Iimbonakalo:
- High-frequency
- Ukuthembeka okuphezulu kunye nokuzinza
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I-Dorp-In Terminations RF Microwave
I-Drop-In Termination (ekwaziwa ngokuba yi-surface-mount termination resistor) yi-surface-mount teknoloji (SMT) icandelo elidityanisiweyo elenzelwe ngokukodwa iisekethe zedijithali ezinesantya esiphezulu kunye neesekethe zerediyo (RF). Umsebenzi wayo ophambili kukucinezela ukubonakalisa umqondiso kunye nokuqinisekisa imfezeko yesiginali (SI). Endaweni yokuba idityaniswe ngeengcingo, ngokuthe ngqo "ifakwe" okanye "ifakwe" kwiindawo ezithile kwiintambo zothumelo ze-PCB (ezifana neentambo ze-microstrip), zisebenza njenge-parallel termination resistor. Iyinxalenye ephambili ekusombululeni imiba yomgangatho wesantya esiphezulu kwaye isetyenziswa ngokubanzi kwiimveliso ezahlukeneyo ezifakwe ngaphakathi, ukusuka kwiiseva zekhompyuter ukuya kwiziseko zonxibelelwano.
Iimpawu:
1. Ukusebenza okungaqhelekanga okuphezulu kunye nokulinganisa okuchanekileyo kwe-impedance
I-Ultra-Low-Low parasitic inductance (ESL): Ukusebenzisa izakhiwo ezithe nkqo kunye nobuchwepheshe bezinto eziphambili (ezifana neteknoloji yefilimu encinci), i-parasitic inductance iyancitshiswa (imilinganiselo yokumelana ngokuqhelekileyo: Inikezela ngamaxabiso achaneke kakhulu kwaye azinzile), ukuqinisekisa ukuba ukupheliswa kwe-impedance kuhambelana ngokuchanekileyo nomgca, ukugqithiswa kwe-5. 75Ω, 100Ω), ukwandisa umqondiso wokufunxa amandla kunye nokuthintela ukubonakaliswa.
Ukuphendula okugqwesileyo okuphindaphindiweyo: Igcina iimpawu zokuxhathisa ezizinzileyo kuluhlu olubanzi lwamafrikhwensi, zisebenza kude kakhulu kwi-axial yendabuko okanye i-radial lead resistors.
2. Uyilo lolwakhiwo oluzalelwe ukudityaniswa kwePCB
Ulwakhiwo oluthe nkqo olulodwa: Ukuqukuqela kwangoku ku-perpendicular kumphezulu webhodi ye-PCB. Ii-electrode ezimbini zibekwe kwindawo ephezulu kunye nesezantsi yecandelo, eqhagamshelwe ngokuthe ngqo kumaleko wesinyithi womgca wothumelo kunye nomgangatho womhlaba, ukwenza eyona ndlela imfutshane yangoku kunye nokunciphisa kakhulu i-loop inductance ebangelwa ngabaxhathisi bemveli abakhokelela.
I-Standard surface-mount Mount Technology (SMT): Iyahambelana neenkqubo zokuhlanganisana ezizenzekelayo, ezifanelekileyo kwimveliso enkulu, ukuphucula ukusebenza kunye nokuhambelana.
I-Compact kunye ne-space-saving: Iisayizi zepakethe ezincinci (umzekelo, 0402, 0603, 0805) zigcina indawo ye-PCB exabisekileyo, iyenza ibe yinto efanelekileyo yoyilo lwebhodi yoxinaniso oluphezulu.
3. Ukuphathwa kwamandla aphezulu kunye nokuthembeka
Ukutshatyalaliswa kwamandla okusebenzayo: Nangona ubukhulu bawo buncinci, i-akhawunti yoyilo ibangela ukuchithwa kwamandla, okwenza ukuba ikwazi ukuphatha ubushushu obuveliswe ngexesha lokupheliswa komqondiso wesantya esiphezulu. Iireyithingi zamandla ezininzi ziyafumaneka (umz., 1/16W, 1/10W, 1/8W, 1/4W).
Ukuthembeka okuphezulu kunye nokuzinza: Iqeshe iinkqubo eziphathekayo ezizinzileyo kunye nezakhiwo ezomeleleyo, zinika amandla omatshini abalaseleyo, ukuchasana nokutshatyalaliswa kwe-thermal, kunye nokuthembeka kwexesha elide, okwenza kube yinto efanelekileyo yokufuna izicelo zamashishini.
Usetyenziso:
1. Ukupheliswa kweebhasi zedijithali ezinesantya esiphezulu
Kwiibhasi ezihamba ngesantya esiphezulu (umzekelo, i-DDR4, i-DDR5 SDRAM) kunye neebhasi ezihlukeneyo, apho amazinga okuhambisa umqondiso aphezulu kakhulu, i-Drop-In Termination resistors ibekwe ekupheleni komgca wothumelo (ukupheliswa kokuphela) okanye kumthombo (ukupheliswa komthombo). Oku kunika indlela ephantsi yokuthintela amandla kunikezelo lwamandla okanye emhlabeni, ukufunxa amandla omqondiso ekufikeni, ngaloo ndlela kuphelisa ukubonakaliswa, ukuhlanjululwa kweempawu zamaza, kunye nokuqinisekisa ukuhanjiswa kwedatha okuzinzile. Esi sesona sicelo saso sakudala kunye nesixhaphakileyo kwiimodyuli zememori (DIMMs) kunye noyilo lwebhodi yomama.
2. Iisekethe ze-RF kunye ne-microwave
Kwizixhobo zonxibelelwano ezingenazingcingo, iisistim zeradar, izixhobo zovavanyo, kunye nezinye iinkqubo zeRF, i-Drop-In Termination isetyenziswa njengomthwalo ohambelanayo kwimveliso yezahluli zamandla, i-couplers, kunye ne-amplifiers. Ibonelela ngothintelo olusemgangathweni lwe-50Ω, ukufunxa amandla agqithisileyo eRF, iphucula ukwahlulwa kwetshaneli, inciphisa iimpazamo zomlinganiselo, kunye nokuthintela ukubonakaliswa kwamandla ukukhusela amalungu anovakalelo eRF nokuqinisekisa ukusebenza kwenkqubo.
3. Ujongano lweserial olunesantya esiphezulu
Kwiimeko apho i-wiring yezinga lebhodi inde okanye i-topology inzima, njenge-PCIe, i-SATA, i-SAS, i-USB 3.0 +, kunye nezinye iikhonkco ze-serial ezinesantya esiphezulu kunye neemfuno ezingqongqo zomgangatho wesignali, umgangatho ophezulu wangaphandle we-Drop-In Termination isetyenziselwa ukuhambelana okulungiselelwe.
4. Uthungelwano kunye nezixhobo zonxibelelwano
Kwii-routers, ukutshintshwa, iimodyuli ze-optical, kunye nezinye izixhobo, apho imigca yesignali yesantya esiphezulu kwi-backplanes (umzekelo, i-25G +) idinga ulawulo olungqongqo lwe-impedance, i-Drop-In Termination isetyenziswe kufuphi nezixhumi ze-backplane okanye ekupheleni kwemigca yokuhambisa ixesha elide ukwenzela ukuba kuphuculwe ingqibelelo yesignali kunye nokunciphisa i-bit error rate (BER).
Qualwaveunikezelo Dorp-In Ukupheliswa kugquma uluhlu frequency DC ~ 3GHz. Umyinge wokuphatha amandla ukuya kuthi ga kwi-100 watts.
Inombolo yendawo | Ukuphindaphinda(GHz, Min.)  | Ukuphindaphinda(GHz, Max.) | Amandla(W) | VSWR(Ubukhulu.) | Flange | Ubungakanani(mm) | Ixesha lokukhokhela(iiveki) |
|---|---|---|---|---|---|---|---|
| QDT03K1 | DC | 3 | 100 | 1.2 | Iiflange ezimbini | 20*6 | 0~4 |
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